keskiviikko 7. syyskuuta 2011

IBM ja 3M tekevät 3D siruja - 1000 kertainen suorituskyky

The computer giant and 3M this week are announcing a collaboration to advance the practice of stacking multiple chips on top of each other, packing much greater computing and data-storage capability together into a small space. Electronics companies now routinely stack a few chips together–particularly memory chips, for use in small devices like cellphones–but IBM is talking about bonding 100 or more chips together, including high-performance microprocessors
http://blogs.wsj.com/digits/2011/09/06/ibm-bets-big-on-stacking-chips-with-3ms-help/

Such three-dimensional structures could be 1,000 times faster than today’s individual chips, IBM estimates, ushering in much more powerful portable devices, PCs and server systems.
Meyerson emphasizes that his definition of 3-D chip technology differs sharply from that of Intel, which recently trumpeted a shift to build a key portion of each tiny transistor with the addition of a vertical, fin-like structure. That approach helps continue to squeeze more of those components on each tiny chip, the pattern of progress known as Moore’s Law.
http://blogs.wsj.com/digits/2011/09/06/ibm-bets-big-on-stacking-chips-with-3ms-help/

That’s where 3M comes in. The Minnesota-based materials company will work with IBM to develop special adhesives that can safely conduct heat away from chips, and processes that can coat hundreds or thousands of chips with glues at one time, the companies say.
http://blogs.wsj.com/digits/2011/09/06/ibm-bets-big-on-stacking-chips-with-3ms-help/

Taso ei ole mikään kovin hyvä muoto suuren suorituskyvyn piirille vaan kolmiuolotteisessa rakenteessa etäisyydet ovat pienemmät. Etäisyydet ja tehot voivat kasvaa valtavasti jos käytössä on kolmiulotteinen rakenne ja jos siihen vielä pystytään yhdistämään 3D optisia rakenteita, niin tehojen kasvu voi olla valtavaa.

A number of companies are currently developing new technologies for building three-dimensional chips, including through using through-silicon vias. But IBM's vision for the potential of chip stacking, as described in the report, appears to be on a much more grand scale than currently known efforts. 
http://www.eetimes.com/electronics-news/4219685/Report--IBM--3M-to-team-on-chip-stacking

Elämme siinä mielessä mielenkiintoisia aikoja, että nyt on olemassa  paljon tutkimustoimintaa, joka voi onnistuessaan mahdollistaa valtavat tehonlisäykset tietokoneissa ja elektroniikassa.
http://tietsikka.blogspot.com/2011/07/tilera-huomattavasti-tehokkaampi.html

http://tietsikka.blogspot.com/2011/07/didolla-100-kertaa-suurempi.html

http://tietsikka.blogspot.com/2011/07/didolla-100-kertaa-suurempi.html

3D rakenteessa iso ongelma on jäähdytys.
http://www.eetimes.com/electronics-news/4077160/IBM-GIT-demo-3D-die-with-microchannel-cooling

Mikroneste jäähdytyksellä on saatu hyviä kokmuksia 3D rakenteiden jäähdytyksestä.

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