3D pakkausteknologiat

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Leveraging advanced packaging technologies for heterogenous chip integration has been a clear trend for many applications. With continuing growth of compute-intensive applications across different industries, 3D IC is enabling innovation for HPC, automotive, IoT and mobile use cases.

Domain-specific chiplets offer the industry incredible value, though they require advanced packaging for teams to have enough options to stack wafers on wafers or chips on wafers to gain higher density, greater functionality and better performance — all while keeping the same or smaller footprint.

No customer or partner can singlehandedly enable system-level innovation at the scale that is needed. Effective collaboration across all chip companies, design partners and foundries in the ecosystem (EDA, IP, DCA/VCA, memory, OSAT, substrate and testing) will be critical to unleash the next step for system integration and product innovation.

Recognizing the need to accelerate 3D IC ecosystem innovation and streamline execution, TSMC launched the TSMC 3DFabric Alliance in October 2022 as part of the existing TSMC OIP. Customers and design companies can now gain access to the platform to collaborate on best-in-class 3D IC solutions and get designs right the first time with clearer product roadmaps.

This empowers the wider ecosystem to develop better-quality 3D IC system designs and achieve faster time to market compared with designing larger monolithic dies — eventually vastly accelerating 3D IC customer adoption and ecosystem readiness.

https://www.eetimes.com/the-importance-of-3d-ic-ecosystem-collaboration/

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Kuva 1. Pilvenpiirtäjä, StableDiffusion